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	<title>Cirexx International - HotPCB Blog - Printed Circuit Board Design, Fabrication, and Assembly Industry &#187; electronics</title>
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		<title>Managing Whiskers &#8211; Both Tin and Facial</title>
		<link>http://www.hotpcb.com/2010/03/managing-whiskers-tin-facial?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=managing-whiskers-tin-facial</link>
		<comments>http://www.hotpcb.com/2010/03/managing-whiskers-tin-facial#comments</comments>
		<pubDate>Fri, 05 Mar 2010 16:04:03 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
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		<category><![CDATA[Tin]]></category>
		<category><![CDATA[Tin Whiskers]]></category>
		<category><![CDATA[Toyota]]></category>

		<guid isPermaLink="false">http://www.cirexx.com/blog/?p=692</guid>
		<description><![CDATA[A big topic in the last few years has been the occurrence of (and the damage caused by) the growth of tin whiskers in high-profile and high-reliability products.  Elusive, often misunderstood, and difficult to prevent; tin whiskers have posed significant problems.  In fact, even just two weeks ago TechEye.net was speculating that tin whiskers may be behind the massive Toyota recalls. Whether the whiskers are out to race cars, or are turning into conductive plasma arcs capable of carrying hundreds of amps, it is clear that they are a force ...]]></description>
			<content:encoded><![CDATA[<p>A big topic in the last few years has been the occurrence of (and the damage caused by) the growth of tin whiskers in high-profile and high-reliability products.  Elusive, often misunderstood, and difficult to prevent; tin whiskers have posed significant problems.  In fact, even just two weeks ago <a href="http://www.techeye.net/chips/electronic-tin-whiskers-may-be-behind-toyota-recalls">TechEye.net was speculating that tin whiskers may be behind the massive Toyota recalls</a>. Whether the whiskers are out to race cars, or are turning into conductive plasma arcs capable of carrying hundreds of amps, it is clear that they are a force to be reckoned with and have a flair for the dramatic.<img class="alignright" style="border: 1px solid white;" src="http://www.cirexx.com/blog/wp-content/uploads/2010/02/whisker1.jpg" alt="tin whisker" width="235" height="113" /></p>
<p>I see a variety of similarities between Tin whiskers&#8230; and my own: Elusive, thin, short, and never helpful.  And there is always the random single hair that frustrates you to no end.</p>
<p>Unfortunately, the costs associated with tin whiskers in the electronics, defense, health, and aerospace industries are astronomical compared to my need to shave once every two weeks.  Failure of products due to tin whisker growth can undermine an entire mission, scrap a program, or take a life.  I think about electronic pacemakers, our men and women traveling to space, or our servicemen and women flying at Mach speeds thousands of feet above the ground.</p>
<p>There has yet to be a definitive ruling made concerning the cause/prevention of whiskers, although pure tin components and plating seem to exhibit the highest likelihood of developing them.  Best practices at this time are to use a tin/lead mix with no greater than 97% tin.  However, RoHS regulations are throwing a wrench into this with its demands for lead-free products.  Some <a href="http://www.rohsguide.com/rohs-faq.htm">RoHS frequently asked questions are answered here</a>.</p>
<p><img class="alignleft" style="border: 1px solid white;" src="http://www.cirexx.com/blog/wp-content/uploads/2010/02/plasmaarcdamage.JPG" alt="ArcDamage" width="179" height="134" /><span style="font-size: small;">This issue received significant attention at the IPC Technology Interchange this last December.  Also, the Center for Advanced Life Cycle  Engineering at the University of Maryland</span><span style="font-size: small;"> (CALCE) and </span><span style="font-size: small;">The Institute of Scientific and Industrial Research at Osaka  University</span> <span style="font-size: small;">(ISIR) are putting on anothe</span><span style="font-size: small;">r </span>International Symposium on Tin Whiskers this June.  The call for papers is still out.  <a href="http://www.pcb007.com/pages/zone.cgi?a=55832&amp;artpg=1&amp;topic=0">Read more about this at PCB007.</a> Proceedings <a href="http://www.calce.umd.edu/tin-whiskers/symposia.htm">from past Symposiums can be found here</a>.</p>
<p>For a great overview of tin whiskers, be sure to <a href="http://nepp.nasa.gov/WHISKER/background/index.htm">check out the resources provided by NASA</a>.  The pictures in this article have all been sourced from NASA.</p>
<p>Have you dealt with tin whiskers in your products/designs? What types of damage have they caused?  What are some of the things you have done to diminish the likelihood of them?</p>
<p><a href="http://www.azonano.com/details.asp?ArticleID=2233">Homepage Image Original found here</a></p>
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		<title>How Rugged is Rugged?</title>
		<link>http://www.hotpcb.com/2010/01/rugged-rugged?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=rugged-rugged</link>
		<comments>http://www.hotpcb.com/2010/01/rugged-rugged#comments</comments>
		<pubDate>Mon, 11 Jan 2010 21:06:54 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
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		<guid isPermaLink="false">http://www.hotpcb.com/?p=613</guid>
		<description><![CDATA[As the keys begin to stick on my Samsung Blackjack II, and I think about how the navigation wheel used to spin freely, I remember the days of my Siemens M56.  That little phone was built like a tiny brick, and it withstood the harshest abuse.  Whether we were swimming in saltwater or it was falling off the top of my moving car, my little phone never complained, remained tough, and always worked.  It was a sad day when, after three and a half years, I had ...]]></description>
			<content:encoded><![CDATA[<div id="attachment_614" class="wp-caption alignleft" style="width: 111px"><img class="size-full wp-image-614" style="border: 1px solid white;" title="00116_blackjack-ii" src="http://www.cirexx.com/blog/wp-content/uploads/2010/01/00116_blackjack-ii.jpg" alt="00116_blackjack-ii" width="101" height="126" /><p class="wp-caption-text">Blackjack II</p></div>
<p>As the keys begin to stick on my Samsung Blackjack II, and I think about how the navigation wheel used to spin freely, I remember the days of my Siemens M56.  That little phone was built like a tiny brick, and it withstood the harshest abuse.  Whether we were swimming in saltwater or it was falling off the top of my moving car, my little phone never complained, remained tough, and always worked.  It was a sad day when, after three and a half years, I had to “upgrade” to a Motorola Razr.</p>
<div id="attachment_615" class="wp-caption alignright" style="width: 98px"><img class="size-full wp-image-615" style="border: 1px solid white;" title="m56" src="http://www.cirexx.com/blog/wp-content/uploads/2010/01/m56.jpg" alt="m56" width="88" height="140" /><p class="wp-caption-text">M56</p></div>
<p>While the M56 was tough, it was never tested or designed as a “rugged” device.  I was very fortunate it survived, but for those whose lives rely upon the dependability of their electronics, chance does not satisfy.  Many manufacturers have recognized the need for electronics able to withstand the harshest of environments, and have designed “rugged” products for use in situations as diverse as the battle field to deep freezers.</p>
<p>But how rugged is the “rugged” classification?  Please comment below if you feel that I am far off&#8230;</p>
<p>What I have found has not surprised me.  It seems that just as I can tell you I am really strong; unless you ask me how much I can bench-press, you really have no idea how true my claims of strength are.  And even if I tell you how much I can lift, you are not sure if I am telling the truth.  The same seems true for the classification of &#8220;rugged&#8221; within the electronics industry.  Many have self-certified their products as rugged, or have developed internal testing procedures under which they qualify their products.  So how do you know what you are getting, and how do you know which rugged product to buy?  Let’s dig further.</p>
<p><img class="alignleft size-full wp-image-616" style="border: 3px solid white;" title="1243012_48445105" src="http://www.cirexx.com/blog/wp-content/uploads/2010/01/1243012_48445105.jpg" alt="1243012_48445105" width="220" height="130" />The very first step you should complete is to determine exactly in what environment your product will be operating.  Some of the various standards/tests include: low pressure altitude testing, high and low temperatures, rain (freezing and penetrating), various forms of shock (both while in operation and while off), humidity, growths (fungus, algae, rust), sand and dust, accelerations, explosions, and various types of vibration.  As you can imagine, every product will meet different standard within each of these categories.  And while phone A may be “rugged” when it relates to salt-water, phone B may be “rugged” as it relates to extreme temperatures.</p>
<p>Fortunately there are various standards in place for the testing of products as it relates to rugged use.  The MIL-STD-810 (Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests) is a 500+ page document<br />
(<a href="http://www.cirexx.com/blog/wp-content/uploads/2010/01/ruggedspec.pdf" target="_blank">open at your own risk, it&#8217;s big</a>) outlining the chamber test methods necessary to use when certifying a product to be rugged in a particular application for military use.  This standard can be tailored for commercial use, and many products advertise that they meet MIL-STD-810 standards in various settings.  For example, you will notice that the<img class="alignright size-full wp-image-619" style="border: 3px solid white;" title="3" src="http://www.cirexx.com/blog/wp-content/uploads/2010/01/3.jpg" alt="3" width="330" height="209" /> <strong><a href="http://www.olympusamerica.com/cpg_section/product.asp?product=1448&amp;page=specs" target="_blank">Olympus Stylus-Tough 8000 is MIL-STD-810 certified to certain levels</a></strong> as it relates to shock and temperature.  But just because it’s rated as rugged does not mean you should take it onto the water slide (although in this case you can… <strong><a href="http://www.olympusamerica.com/cpg_section/product.asp?product=1448&amp;page=overview" target="_blank">see the video on this page</a></strong>).</p>
<p>Some companies certify themselves to the MIL-STD-810 standards, while others use outside auditing organizations to confirm their claims.  If it were me, I would always require an external auditing organization to confirm the claims made (especially if the product is protecting the life of someone).  Some companies have developed and branded their own systems of rugged classification.  For instance, <strong><a href="http://www.sonimtech.com/" target="_blank">Sonim cell phones</a></strong> adhere to the “Rugged Performance Standards” set in place by Sonim.  <strong><a href="http://www.sonimtech.com/products/rps.php" target="_blank">Take a look at the video.  It is pretty neat</a>.</strong> Though again, always make sure that an outside agency has substantiated the claims made by the manufacturer.</p>
<p>So just as I will tell you that I am very strong, and you would ask me to qualify my statements; so too should you always seek to qualify the statements made in regards to the rugged nature of various electronics.  What do you need it to withstand?  What standards does it claim to adhere to?  Have those claims been substantiated by an outside agent?</p>
<p>Enjoy!</p>
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		<title>U.S. Consulates Help IPC APEX EXPO Exhibitors Reach Across Oceans and Borders to Develop Business and Partnerships</title>
		<link>http://www.hotpcb.com/2009/12/consulates-ipc-apex-expo-exhibitors-reach-oceans-borders-develop-business-partnerships?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=consulates-ipc-apex-expo-exhibitors-reach-oceans-borders-develop-business-partnerships</link>
		<comments>http://www.hotpcb.com/2009/12/consulates-ipc-apex-expo-exhibitors-reach-oceans-borders-develop-business-partnerships#comments</comments>
		<pubDate>Fri, 18 Dec 2009 19:04:24 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
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		<guid isPermaLink="false">http://www.hotpcb.com/?p=578</guid>
		<description><![CDATA[ 
 
U.S. Consulates Help IPC APEX EXPO Exhibitors Reach Across Oceans and Borders to Develop Business and Partnerships  
 
BANNOCKBURN, Ill., USA, December 18, 2009 — The U.S. Department of Commerce has chosen IPC APEX EXPOTM as one of a select group of U.S. trade shows to participate in its International Buyer Program (IBP) for 2010. The event, produced by IPC — Association Connecting Electronics Industries®, was chosen by a vote of U.S. embassies, consulates and commercial centers worldwide. One measure was the show’s appeal to overseas visitors. ...]]></description>
			<content:encoded><![CDATA[<p><strong> </strong></p>
<p><strong> </strong></p>
<p align="center"><strong>U.S. Consulates Help IPC APEX EXPO Exhibitors Reach Across Oceans and Borders to Develop Business and Partnerships </strong><strong><em> </em></strong></p>
<p><strong> </strong></p>
<p><strong>BANNOCKBURN, Ill., USA, December 18, 2009 </strong>—<strong> </strong>The U.S. Department of Commerce has chosen <a href="http://www.ipcapexexpo.org/html/main/default.htm">IPC APEX EXPO<sup>TM</sup></a> as one of a select group of U.S. trade shows to participate in its International Buyer Program (IBP) for 2010. The event, produced by <a href="http://www.ipc.org/">IPC — Association Connecting Electronics Industries®</a>, was chosen by a vote of U.S. embassies, consulates and commercial centers worldwide. One measure was the show’s appeal to overseas visitors. In 2009, 15 percent of attendees came from 42 countries other than the United States.</p>
<p>“We’re pleased to be able to provide this exclusive opportunity to our exhibitors to help them expand their businesses globally,” says Kim Sterling, IPC vice president of marketing &amp; communications. As one of only 36 U.S. trade shows in the IBP, IPC APEX EXPO has secured support from Commercial Service officers around the world who will reach out to their local regions to recruit qualified buyers, sales representatives and business partners to the event.</p>
<p>Country and industry experts from the U.S. Commercial Service will be on-site during IPC APEX EXPO to help companies with hands-on export counseling, marketing analysis and matchmaking services. In addition to the increased global promotion of the event, a special Export Interest Guide will be provided to all international attendees to give them an easy way to identify IPC APEX EXPO exhibitors who are interested in exporting to specific international markets.</p>
<p>Only <a href="http://www.ipcapexexpo.org/exhibitors">IPC APEX EXPO 2010 exhibitors</a> may participate in the IBP as suppliers. Information is available at <a href="http://www.ipcapexexpo.org/IBP">www.IPCAPEXEXPO.org/IBP</a> for current exhibitors. Companies that are interested in exhibiting should contact IPC Director of Trade Show Sales Mary Mac Kinnon at +1 847-597-2886 or <a href="mailto:MaryMacKinnon@ipc.org">MaryMacKinnon@ipc.org</a>.</p>
<p>For more information on IPC APEX EXPO, visit <a href="http://www.ipcapexexpo.org/">www.IPCAPEXEXPO.org</a>. Individuals who are interested in visiting the show as part of an international delegation should contact their local U.S. commercial specialist, embassy or consulate. Links to local consulates as well as information on obtaining visas, translated in eight languages, is available at <a href="http://www.ipcapexexpo.org/international">www.IPCAPEXEXPO.org/international</a>.</p>
<p align="center"># # #</p>
<p><strong>About IPC</strong></p>
<p>IPC (<a href="http://www.ipc.org/">www.IPC.org</a>) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.</p>
<p><strong>Contact:</strong></p>
<p>Anna Garrido, IPC Director of Marketing and Communications<br />
+1 847-597-2804<br />
<a href="mailto:AnnaGarrido@ipc.org">AnnaGarrido@ipc.org</a></p>
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		<item>
		<title>When/Where/Will PCB Technology Hit a Plateau?</title>
		<link>http://www.hotpcb.com/2009/12/whenwherewill-pcb-technology-hit-plateau?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=whenwherewill-pcb-technology-hit-plateau</link>
		<comments>http://www.hotpcb.com/2009/12/whenwherewill-pcb-technology-hit-plateau#comments</comments>
		<pubDate>Tue, 15 Dec 2009 19:20:22 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
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		<guid isPermaLink="false">http://www.hotpcb.com/?p=556</guid>
		<description><![CDATA[Within one of the presentations last week at the IPC Technology Interchange in Washington D.C., the question was raised of whether printed circuit board technology will reach a plateau or whether it will continue to keep pace with the technological demands and innovations to come.  Restated, the question could be:  as trace widths get smaller, nanotechnology improves, and demand for greater performance continues to increase &#8211; when/where/will PCB technology hit a plateau?
This is a complex question with a large number of factors.  One focus of the discussion could be on ...]]></description>
			<content:encoded><![CDATA[<p><img class="alignleft size-full wp-image-557" style="border: 3px solid white;" title="862338_39384132" src="http://www.hotpcb.com/wp-content/uploads/2009/12/862338_39384132.jpg" alt="862338_39384132" width="292" height="195" />Within one of the presentations last week at the <a href="http://www.ipc.org/calendar/2009/NA-PCB-Industry-Military-1209/NA-PCB-Military-Conference-brochure.htm" target="_blank">IPC Technology Interchange in Washington D.C.</a>, the question was raised of whether printed circuit board technology will reach a plateau or whether it will continue to keep pace with the technological demands and innovations to come.  Restated, the question could be:  as trace widths get smaller, nanotechnology improves, and demand for greater performance continues to increase &#8211; when/where/will PCB technology hit a plateau?</p>
<p>This is a complex question with a large number of factors.  One focus of the discussion could be on the pure technical limitations which will be reached according to the laws of physics, or you may consider the unlikelihood that we will ever meet a need that PCB&#8217;s can&#8217;t handle due to the high costs which would surround that new technology.</p>
<p>I hope to hear your input and comments.  Where do you see the technology going and needing to innovate?  How do you see <a href="http://en.wikipedia.org/wiki/System_in_package" target="_blank">system-in-a-package</a> and 3D Integration being a factor?  I don&#8217;t even have all of the appropriate questions surrounding this topic, but I hope that the comments below will be full of insight and discussion.</p>
<p>Thanks!!</p>
<p>P.S. Someone should add to the wikipedia article about system-in-a-package.  It could use some help.</p>
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		</item>
		<item>
		<title>The world&#8217;s least efficient &#8220;electronic&#8221; car</title>
		<link>http://www.hotpcb.com/2009/03/worlds-efficient-electronic-car?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=worlds-efficient-electronic-car</link>
		<comments>http://www.hotpcb.com/2009/03/worlds-efficient-electronic-car#comments</comments>
		<pubDate>Fri, 20 Mar 2009 14:13:42 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
				<category><![CDATA[Off Topic]]></category>
		<category><![CDATA[autos]]></category>
		<category><![CDATA[electric cars]]></category>
		<category><![CDATA[electronics]]></category>
		<category><![CDATA[Humor]]></category>
		<category><![CDATA[photos]]></category>

		<guid isPermaLink="false">http://www.hotpcb.com/?p=63</guid>
		<description><![CDATA[]]></description>
			<content:encoded><![CDATA[<div id="attachment_64" class="wp-caption alignleft" style="width: 510px"><img class="size-full wp-image-64" title="circuit-board-car" src="http://www.hotpcb.com/wp-content/uploads/2009/03/circuit-board-car.jpg" alt="not sure what would happen if I brought this home" width="500" height="288" /><p class="wp-caption-text">not sure what would happen if I brought this home</p></div>
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		</item>
		<item>
		<title>PCB East 2009</title>
		<link>http://www.hotpcb.com/2009/03/pcb-east-2009?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=pcb-east-2009</link>
		<comments>http://www.hotpcb.com/2009/03/pcb-east-2009#comments</comments>
		<pubDate>Thu, 19 Mar 2009 18:55:09 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
				<category><![CDATA[Networking]]></category>
		<category><![CDATA[Boston]]></category>
		<category><![CDATA[Conferences]]></category>
		<category><![CDATA[Connections]]></category>
		<category><![CDATA[electronics]]></category>
		<category><![CDATA[hardware]]></category>
		<category><![CDATA[High Technology]]></category>
		<category><![CDATA[Medical Technology]]></category>
		<category><![CDATA[PCB]]></category>
		<category><![CDATA[PCB East]]></category>
		<category><![CDATA[TableTop Shows]]></category>

		<guid isPermaLink="false">http://www.hotpcb.com/?p=49</guid>
		<description><![CDATA[
PCB East Website

LinkedIn Group
Do you, or any of your co-workers, plan on attending the PCB East 2009 Conference in Waltham-Boston, MA?  If you do, you should join the LinkedIn group &#8220;PCB East Pre-Event Networking&#8221;.  There you can begin to network with potential suppliers, customers, and colleagues. Why wait until that week to begin your research and to develop your relationships?  Start now and ensure that your time there is spent efficiently.  Feel free to discuss dinner options, happy hours, local events, and any other networking opportunities ...]]></description>
			<content:encoded><![CDATA[<p><img class="size-full wp-image-50 alignleft" title="pcbeast2009" src="http://www.hotpcb.com/wp-content/uploads/2009/03/pcbeast2009.jpg" alt="pcbeast2009" width="155" height="133" /></p>
<p><a href="http://pcbeast.com/">PCB East Website</a></p>
<p><a href="http://pcbeast.com/"><br />
</a><a href="http://www.linkedin.com/groups?gid=1854776">LinkedIn Group</a></p>
<p>Do you, or any of your co-workers, plan on attending the PCB East 2009 Conference in Waltham-Boston, MA?  If you do, you should join the LinkedIn group &#8220;PCB East Pre-Event Networking&#8221;.  There you can begin to network with potential suppliers, customers, and colleagues. Why wait until that week to begin your research and to develop your relationships?  Start now and ensure that your time there is spent efficiently.  Feel free to discuss dinner options, happy hours, local events, and any other networking opportunities you might like to see occur that week.</p>
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		<title>Doing Yoga within an Olympus Stylus</title>
		<link>http://www.hotpcb.com/2009/03/olympus_stylusjpg-jpeg-image-2045x1379-pixels-scaled-55?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=olympus_stylusjpg-jpeg-image-2045x1379-pixels-scaled-55</link>
		<comments>http://www.hotpcb.com/2009/03/olympus_stylusjpg-jpeg-image-2045x1379-pixels-scaled-55#comments</comments>
		<pubDate>Mon, 16 Mar 2009 15:33:52 +0000</pubDate>
		<dc:creator>Cirexx Blog</dc:creator>
				<category><![CDATA[Consumer Applications]]></category>
		<category><![CDATA[camera]]></category>
		<category><![CDATA[Circuits]]></category>
		<category><![CDATA[consumer electronics]]></category>
		<category><![CDATA[electronics]]></category>
		<category><![CDATA[Flex]]></category>
		<category><![CDATA[hardware]]></category>
		<category><![CDATA[photography]]></category>
		<category><![CDATA[rigid-flex]]></category>
		<category><![CDATA[rigidflex]]></category>

		<guid isPermaLink="false">http://www.hotpcb.com/?p=9</guid>
		<description><![CDATA[
It is amazing how flexible circuits allow intricate and complex electronics continue to decrease in size.  As flex and rigid-flex are developed, unique applications will continue to arise.  This picture really makes you wonder how complex in the inner workings of our most common, taken for granted, electronics are.
]]></description>
			<content:encoded><![CDATA[<p><img src="file:///C:/Documents%20and%20Settings/Liam%20Morris/My%20Documents/My%20Pictures/Olympus_Stylus.jpg" alt="" /><a href="http://en.wikipedia.org/wiki/File:Olympus_Stylus.jpg" rel="shadowbox[sbpost-9];player=img;"><img class="size-full wp-image-12 alignnone" title="olympus_stylus" src="http://www.hotpcb.com/wp-content/uploads/2009/03/olympus_stylus.jpg" alt="olympus_stylus" width="245" height="166" /></a></p>
<p>It is amazing how flexible circuits allow intricate and complex electronics continue to decrease in size.  As flex and rigid-flex are developed, unique applications will continue to arise.  This picture really makes you wonder how complex in the inner workings of our most common, taken for granted, electronics are.</p>
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