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Arlon Materials
Arlon Materials For Electronics Division specializes in Microwave Materials and Substrates. Arlon materials are developed for the fabrication of high performance and frequency dependent printed circuit boards. |
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These materials can be used in many applications, from wireless communications to semiconductor test and measurement equipment.
We can use almost any Arlon Materials for any of your PCB Fabrication. Please contact one of our Sales Representative for specific information regarding special material usage. |
Electronic Substrates
Polyimide Products
Epoxy Products
Legacy Thermount® Products
Specialty Foils
Electrodeposited, High Temperature Elongatsion, Copper Foil
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Double Treat and Drum Side Treated Copper Foil |
5 & 9 Micon Copper Foil (Fine Line Designs) |
Ohmega-Ply® Resistive Clad Copper Foil (Etched Planar Resistors) |
Microwave Products
CLTE PRODUCT FAMILY (Highest degree of Performance)
TC PRODUCT FAMILY (Thermally Conductive, Temperature Phase Stable)
Next Generation of Lower Loss Materials, Available with PIM+ Technology
PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Unidirectional Plies
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Woven Fiberglass Reinforced PTFE - Crossplied
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Non-Woven Reinforced PTFE
Ultra Thin Laminates with Higher Dielectric Constant
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
Reduced Passive Intermodulation (PIM) Laminates
Legacy, Low Cost Commercial Based Laminates
Thermoplastic Bonding Films for Stripline and Multilayer Packages
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